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1112 AN- 1112 DSBGA Wafer Level Chip Scale Package. ABSTRACT. This application note provides information about the Die Size BGA (DSBGA) Wafer Level Chip The S- 1112 /1122 Series is a positive voltage regulator with a low dropout the lineup includes the S- 1112 and S-1122 Series, which differ in pin configuration. 3M Light Cure Adhesive LC- 1112 is a one-component, medium viscosity adhesive that cures rapidly when exposed to UV light to form a semi-rigid bond. . Symbol. Conditions. Ratings. IF(RMS). 7. A. IF(AV)M air self cooling,. Tamb = 45 C. - without cooling plate. 2.0. A. - with colling plate. 2.5. A forced air cooling:. Note: To build a part number, visit our website at www.bergquistcompany.com. Standard thicknesses available: 0.005, 0.008, 0.011. 00 = No adhesive. 1112 ...
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