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【1928402452 BOSCH】【1112】【GRM1885C1H390GA01D】Electronic Components In Stock Suppliers in 2018【Price】【Datasheet PDF】USA

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1112 AN- 1112 DSBGA Wafer Level Chip Scale Package. ABSTRACT. This application note provides information about the Die Size BGA (DSBGA) Wafer Level Chip The S- 1112 /1122 Series is a positive voltage regulator with a low dropout the lineup includes the S- 1112 and S-1122 Series, which differ in pin configuration. 3M Light Cure Adhesive LC- 1112 is a one-component, medium viscosity adhesive that cures rapidly when exposed to UV light to form a semi-rigid bond. . Symbol. Conditions. Ratings. IF(RMS). 7. A. IF(AV)M air self cooling,. Tamb = 45 C. - without cooling plate. 2.0. A. - with colling plate. 2.5. A forced air cooling:. Note: To build a part number, visit our website at www.bergquistcompany.com. Standard thicknesses available: 0.005, 0.008, 0.011. 00 = No adhesive. 1112 ...
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Part NumberPart Number BrandD/CQtyCountry /


1-928-402-452 BOSCH20Italy
Ramos S.R.L. 13

1 928 402 452

1 928 402 452 ROBERT BOSCH20France
FantastIC Sourcing 13


1928402452 5000Hong Kong
Lungke Electronics Technology Co., Limited  8

1 928 402 452

1 928 402 452 2767USA
Chip 1 Exchange USA, Inc.  1


1112 ON09+1500China
Gaokeda Technology (HK) Limited  10

1112 LT37,5

1112 LT37,5 5USA
Chip 1 Exchange USA, Inc.  1


1-1123309-2 TE CONNECTIVITY200Japan
Wintec Mfg. (Japan) Corporation 13


111-249-269-AV002 SDP COMPONENTS INC351USA
Val Technologies, Inc 15


1-1123309-2 TE735France
FantastIC Sourcing 13


GRM1885C1H390GA01D Murata84000Hong Kong


GRM1885C1H390GA01D Murata Electronics95800Hong Kong
AIC Semiconductor Co., Limited  5


GRM1885C1H390GA01D MURATA68000Hong Kong


GRM1885C1H390GA01D MUR064000USA
Dan-Mar Components Inc. 10


GRM1885C1H390GA01D MURATA15+60000Hong Kong
HongKong Honesty Electronic Technology Limited 9

Buy: 1928402452, 1112, GRM1885C1H390GA01D
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1112 | GRM1885C1H390GA01D | 1928402448 | 19284025 | 1928402571 | 1928402571 | 1928402572 | 1928402579 | 1928402587 | 1928402595 | 1928402642

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