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Search For 5SGXMA3E2H29I2N - 5SGXMA3E2H29I2N Suppliers : 

Digchip Technology Co.,Limited , HongKong Wanghua Technology Limited , Bonase Electronics (HK) Co., Limited  ...
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Part Number Part Number Brand D/C Desc Qty Country /
5SGXMA3E2H29I2N 5SGXMA3E2H29I2N  Altera 2013IC FPGA 360 I/O... 1050
Hong Kong
Digchip Technology Co.,Limited E-Catalog 1st Year Member

5SGXMA3E2H29I2N 5SGXMA3E2H29I2N  Altera Corporat... 12000Hong Kong
HongKong Wanghua Technology Limited E-Catalog 2nd Year Member

5SGXMA7K2F40C3N 5SGXMA7K2F40C3N  ALTERA 2015+BGA 201China
Bonase Electronics (HK) Co., Limited E-Catalog 10th Year Member

5SGXMA5K2F40C2N 5SGXMA5K2F40C2N  1Taiwan
E-Power Market Co.,Ltd E-Catalog 8th Year Member

Dan-Mar Components Inc. E-Catalog 8th Year Member

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04023J100FBSTR | 0805105J | 100131FC | 11NU735/1UE | 1582578 | 15KE68V | 1690001A30 | 180078272020 | 1N4729A/D9 | 1SDA012655R1 [hkinbatch018b] [hkingendate20160630] [hkingenidC77501][hkinOfferInventC]
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IC FPGA 360 I/O 780HBGA Number of LABs/CLBs: 128300 Number of Logic Elements/Cells: 340000 Total RAM Bits: 23704576 Number of I/O: 360 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: -40~C ~ 100~C Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33x33) HKinDataSheet_ZO1GOSIT

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