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Hong Kong Inventory Limited

【ADC07D1520CIYB/NOPB TI】【5AGXMA3D4F27C4N】【HX25P】HKinventory - Suppliers in 2017【Price】【Datasheet PDF】USA

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ADC07D1520CIYB/NOPB, 5AGXMA3D4F27C4N, HX25P
 Part NumberBrandD/CQtyCompany

ADC07D1520CIYB/NOPB

TI80E-Core Electronics Co.    8

ADC07D1520CIYB/NOPB

Texas Instruments16630HongKong Wanghua Technology Limited   3

5AGXMA3D4F27C4N
 

ALTERA1000Kang Da Electronics Co.    12

5AGXMA3D4F27C4N
 

ALTERA12000OCEANIA INTERNATIONAL INDUSTRIAL LIMITED    10

5AGXMA3D4F27C4N
 

ALTERA153E-Core Electronics Co.    8

5AGXMA3D4F27C4N
 

Altera20131050Digchip Technology Co.,Limited    2

5AGXMA3D4F27C4N
 

ALTERA1000ICMALL LIMITED   3

HX 25-P

LEM2015+200Dopoint Hi-Tech Limited    12

HX25-P

LEM101600Daejon Electronics  5

HX25-P

LEM Sensor50000Hongkong Shengshi Electronics Limited   3

ADC07D1520CIYB/NOPB Description

IC ADC 7BIT DUAL 1.5GSPS 128LQFP Series: - Number of Bits: 7 Sampling Rate (Per Second): 3G Number of Inputs: 2 Input Type: Differential Data Interface: LVDS - Parallel Configuration: MUX-S/H-ADC Ratio - S/H:ADC: 1:01 Number of A/D Converters: 2 Architecture: Folding Interpolating Reference Type: Internal Voltage - Supply, Analog: 1.8 V ~ 2 V Voltage - Supply, Digital: 1.8 V ~ 2 V Features: Simultaneous Sampling Operating Temperature: -40~C ~ 85~C Package / Case: 128-LQFP Exposed Pad Supplier Device Package: 128-HLQFP (20x20)

5AGXMA3D4F27C4N Description

IC FPGA 336 I/O 672FBGA Number of LABs/CLBs: 7362 Number of Logic Elements/Cells: 156000 Total RAM Bits: 11746304 Number of I/O: 336 Number of Gates: - Voltage - Supply: 1.07 V ~ 1.13 V Mounting Type: Surface Mount Operating Temperature: 0~C ~ 85~C Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA (27x27)

HX25P Description

Jun 9, 2016 Pressure Gauge: Monitoring Circuit 1P1- P , Rated for 5000 psi, ajt80 fuse, zc-fd -103 100a fusible, rotary, 100 va trans, 30 h x 25 w x 10d. 23-6 H X 25 W. (TELESCOPING). 19-6 H X 20 E-TE- P L. E-R. E-RT. E-R. E-R E-R. E-R. E-RE-R. E-R. E-F. E-F. E-R E-R. E-R. E-R. E-R. E-F. E-R. E-R E-R. across all ports, 802.3x flow control, 802.1 p priority packet processing, self- learning 4K-node address table, large 240KB packet buffers for 10/100 and 120KB P (IN. WC). AIRFLOW (CFM). M13662. WHEN FIRST INSTALLED. PRESSURE DROP INCREASES AS FILTER. BECOMES LOADED. REPLACE FILTER WHEN 67 mm w x 100 mm h x 25 mm d. (2.6 w x 4 h x 1 d) . LOCAL OPERATION ( continued). PROGRAM KEYPAD. Key. 0 to 9 values. P decimal point. PXXX.

Related Part Number

5AGXMA3D4F27C4N | HX25P | ADC05U09 | ADC0800 | ADC0800LCN | ADC0800PD | ADC0801S040TS | ADC0803 | ADC08031 | ADC08038 | ADC0803CCN
ADC07D1520CIYB/NOPB Ref.: [hkinbatch20170420] [HGCacheDateZOITOTZS] [HGReferer_STC_Overview] [HKINGESTYLE]

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HKin.com advertises product requirements from buyers around the world. The number of inquiries exchanged is over 350,000 cases per month, and lots of trade deals concluding everyday. Reproduction in whole or in part in any form without the written permission of Hong Kong Inventory Limited is prohibited. All rights reserved. Our new customer services center at Shenzhen SEG Electronics Market becomes the first focal tactic after the 6th anniversary. HKI is the initial electronics components trading online platform to have customer services center. A trading hub for brokers, merchandisers and distributors to trade all kinds of electronic components, including semiconductors, passive components, obsolete and hard-to-find parts. HKin.com is dedicated to serving the electronic components industry. Our online services, tailored to meet the needs of industry players, include integrated stock trading services, sourcing direct suppliers / manufacturers, marketing and cataloging tools for the global electronic components community.
Ceramic components PCB chemicals Clean room clothing Discounted semiconductors EMI shielding Epoxy compounds Ferrite cores/bars/EI Ferrite powder Ferrite plastic Finger cots Dry cells Rechargeable batteries/packs Time switches Lightning and Surge Protection Devices Tachometers DC/DC converters Hinges Heating elements IC packaging materials Insulation materials Iron powder Laminates Lead wire Lenses
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