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AS2P5MA l ead fr ee, b ul k. T2855-3. MAX2016ETI +TD -40 C to +85 C. 28 Thi n QFN - E P *, l ead fr ee, T/R. T2855-3. *EP = Exposed pad. +Indicates lead-free package. Product Content Information for: MAX2016ETI -T. Links. Qualifications. Package Description. Chemical Composition Summary. Detailed Package Component Product Content Information for: MAX2016ETI +T. Links. Qualifications. Package Description. Chemical Composition Summary. Detailed Package Component MAX2016ETI . . 1. PCB: MAX2016EVKIT. Component List. The exposed paddle conductor on U1 must be solder-attached to a grounded pad on the PCB to MAX2016ETI +TD -40 C to +85 C. 28 Thi n QFN - E P *, l ead fr ee, T/R. T2855-3. * EP = . = . D = . ...
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