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【BCM4343W BROADCOM】【RC1206FK0772RL】【TD6373NT1】HKinventory - Suppliers in 2017【Price】【Datasheet PDF】USA

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 Part NumberBrandD/CQtyCompany
RC1206FR-070RLYageo20000Wuhan P&S Information Technology Co., Ltd.   3

BCM4343W, RC1206FK0772RL, TD6373NT1
 Part NumberBrandD/CQtyCompany
BCM4343SKUBG
 
BROADCOM2015+100000East Pioneer Electronic Co., Limited    5
BCM4342EKFBGBROADCOM1000E-Power Market Co.,Ltd   8
BCM43438KUBGBROADCOM2015+101Bonase Electronics (HK) Co., Limited    11
BCM4342KFBG-P11BROADCOM1137+947Win Source Electronic Technology Limited    11
BCM43438KUBGBroadcom2015+25001Creation (HK) Technology Co.,Limited  1
RC1206FK-0772RLYAGEO5YKX Torch International Limited  2
RC12066FR-072KLYAGEO1142+5462Shenzhen Chuangxinda Electronic-Tech Co.,Ltd    14
RC1206FR-071K33LYAGEO50Hongkong Rixin International Trading Company    1
RC1206FR-070RLYGO201548Kwong Shun Electronics (HK)Co.   12
TD6373N-T1TOS2774Shenzhen Chuangxinda Electronic-Tech Co.,Ltd    14
TD6373N-T1TOS2774Zhengxinyuan Electronics (HK) Co., Limited   11
TD6373N-T1TOS12+2774TOP-Q COMPONENT PTE. LTD   3
TD6373N-T1TOS2774H.T. Electronics Industrial Co., Limited    11
TD6373N-A1TOS93+140Shenzhen Chuangxinda Electronic-Tech Co.,Ltd    14

BCM4343W Description

Aug 24, 2015 Single-Chip IEEE 802.11 b/g/n MAC/Baseband/. Radio with Bluetooth 4.1, an FM Receiver, and. Wireless Charging. Figure 1: BCM4343W System Block Diagram. GENERAL DESCRIPTION. The Broadcom BCM4343W is a FEATURES AND BENEFITS. Delivers IEEE 802.11 b/g/n, BT 2.1+EDR, and BLE. 4.1 wireless connectivity. Based on next-generation silicon from Broadcom. ( BCM4343W ). Three versions of the module available: SiP without antenna BCM4343W ). With an industrial temperature rating, broad country certifications, and the availability of three different package styles, the. Sterling-LWB provides significant flexibility to meet various end user application needs. The on-module Wi-Fi /Bluetooth Modules for NXP i.MX. Type 1DX. PN: LBEE5KL1DX. BCM4343W Chipset. Dimensions: 6.95 x 5.15 x 1.1mm. NEW wireless.murata. com/imx. wirelessFAQ@murata.com. Modules and kits available through distribution. BCM4343W Chipset. 6.95 x 5.15 x 1.1 mm. Type YD/1CD. PN: LBWA1ZVYDZ- xxx. PN: LBWA1ZV1CD-716 (Imp003)*. BCM43362+STM Chipset. 10.0 x 7.9 x 1.25 mm. Type 1HD/1MD. PN: LBWA1ZZ1HD-004 (WICED). PN: LBWA1ZZ1MD- 001

TD6373NT1 Description

TD6373N-T1, TOS, DIP42

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BCM4343W Ref.: [hkinbatch20161020] [HGCacheDateZOITOIZZ] [HGReferer_STC_Overview]
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