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【MC100LVEL32DG ON Semiconductor】【BU61588G3170】【BG3011D08LA4TB】HKinventory - Suppliers in 2016【Price】【Datasheet PDF】USA

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MC100LVEL32DG, BU61588G3170
 Part NumberBrandD/CQtyCompany
MC100LVEL32DGON Semiconductor2015+111Bonase Electronics (HK) Co., Limited    10
MOT11+12000Huaerda Technology Co.,Limited    9
MC100LVEL32DGON Semiconductor181Sdiamond Electronics Co.,Ltd   12
ON10+110Asia Components Co.,Limited    9
MC100LVEL32DGON Semiconductor15810Riking Technology (HK) Co., Limited   7
BU61580S1-140 5962-9306503DDC265Fossion International    8
BU61580S3-110DDC12+30Tide Electronic Co.,Limited    7
BU-61580S3-110KDDC04+1908HK Jiaweiyi Technology Limited    11
BU61580VDDC06+8500Kehai Weiye International Electronics Limited    10

BG3011D08LA4TB Description

IC DIVIDER DIV X2 ECL 3.3V 8SOIC Series: 100LVEL Logic Type: Divide-by-2 Direction: - Number of Elements: 1 Number of Bits per Element: 1 Reset: Asynchronous Timing: - Count Rate: 2.6GHz Trigger Type: Positive, Negative Voltage - Supply: 3 V ~ 3.8 V Operating Temperature: -40~C ~ 85~C Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154, 3.90mm Width) Supplier Device Package: 8-SOIC

BG3011D08LA4TB Related Keywords in 2016 USA

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BG3011D08LA4TB Ref.: [hkinbatch20160715] [HGReferer_SD_Ecatalog]
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