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【FDMC7200 Fairchild Semiconductor】【AP2R803GH】【E39F18】Electronic Components In Stock Suppliers in 2017【Price】【Datasheet PDF】USA

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FDMC7200 Datasheet Jun 1, 2009 Thermal Resistance, Junction to Case. 7.5. 4. Device Marking. Device. Package. Reel Size. Tape Width. Quantity. FDMC7200 . FDMC7200 . Jul 14, 2015 FDMC7200 . FDMC7200 . MLP-8. (TFNiPdAuAg_CuB. W)(G). Jul 14, 2015. 1.0. SUBCON. 0.0211 g. Each. Manufacturing Process Information. Jul 14, 2015 Site Owner. Assembly. Location. Package. Weight(g). MSL. Rating. FDMC7200 . MLP-8 (TFNiPdAuAg_CuBW)(G). SUBCON. SUBCON. 0.0211. 0. 0. LOT: PMH010088888. FSID: FDMC7200 . D/C1: P1215NA QTY1: SPEC REV: 2nd Level Interconnect. D/C2: QTY2: QTY: 3000. SPEC: RoHS. COMPLIANT. ESD Logo Label sample. ESD Logo Label. F63TNR Label. LOT: PMH010088888 . FSID: FDMC7200 . D/C1: P1215NA QTY1: SPEC REV: 2nd Level Interconnect. ...
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Part NumberPart Number BrandD/CQtyCountry /


FDMC7200 Fairchild Semiconductor16155Hong Kong
HongKong Wanghua Technology Limited 3


FDMC7200 FAIRCHILD09+3200China
Shenzhen Chuangxinda Electronic-Tech Co.,Ltd  14


FDMC7200 FSC1117+4985China
Hong Kong In Fortune Electronics Co., Limited  12


Winni (HK) Electronic Company 8


FDMC7200 FSC11174985China
L C Great Exploit Limited 10


AP2R803GH 12+11+25500China
Hong Kong In Fortune Electronics Co., Limited  12


AP2R803AGMT-HF APEC/85000Hong Kong
Hongkong Rixin International Trading Company  1


E39-F18 Omron32500Hong Kong
Add Components Limited  6


E39-F18 OMRON19Hong Kong
WH Technology Company2

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AP2R803GH | E39F18 | FDMC4436BZ | FDMC6676BZ | FDMC6683 | FDMC7572S | FDMC8030 | FDMC8200 | FDMC8298 | FDMC86116LZ | FDMC86261P

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