【K4B2G1646FHCF8 SAMSUNG】【3200100261】【RFSW6124PCK410】Electronic Components In Stock Suppliers in 2018【Price】【Datasheet PDF】USA

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K4B2G1646FHCF8 Description

Datasheet Dec 27, 2010 DDR3-1600(11-11-11)4 DDR3-1866(13-13-13)3 DDR3-2133(14-14-14)2. Package. 128Mx16. K4B2G1646C - HCF8 . K4B2G1646C -HCH9. 96ball FBGA. Now. 2Gb C-die. 8Banks. K4B2G1646C . HQH9. 128M x 16. SSTL_15. 8K/64m. 1.5V 0.075V. 96ball FBGA. Now. 2Gb E-de. 8Banks. K4B2G1646E.
1 - 13 of 13 Record(s)
Hot Offer
 Part NumberBrandD/CQtyCompany


RFMD16+6500ShenZhen HuaXingWei Electronics Co., Ltd.    1

K4B2G1646FHCF8, 3200100261, RFSW6124PCK410
 Part NumberBrandD/CQtyCompany


SAMSUNG2012300Pacific Corporation   17


SAMSUNG16+20000Daejon Electronics  6


SAMSUNG17+11200C&G Electronics (HK) Co., Ltd   1


SAMSUNG500Shenzhen Zhengrun Electronics Co.,Ltd   14


SAM889Takson Electronics (H.K.) Co., Ltd.   4


PANTECH03+10000Aric Electronics Technology (HK) Co., Limited   12


N/A16841HongKong Wanghua Technology Limited   3


PANTECH10000Aric Electronics Technology (HK) Co., Limited   12




RFMD16+5000ShenZhen HuaXingWei Electronics Co., Ltd.    1


RFMD2015+1500Bonase Electronics (HK) Co., Limited    12



Related Part Number

3200100261 | RFSW6124PCK410 | K4B2G1646FHCH9 | K4B2G1646GBCH9 | K4B2G1646Q | K4B2G1646QBCH9 | K4B2G1646Q-BCH9 | K4B2G1646QBCK0 | K4B2G1646QBCK0 | K4B2G1646Q-BCK0 | K4B2G1646QBCK0000
K4B2G1646FHCF8 Ref.:

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