【K4B4G1646DBYK0 BGA】【BR24L32FJWE2】【M67191P】Electronic Components In Stock Suppliers in 2018【Price】【Datasheet PDF】USA

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K4B4G1646DBYK0 Description

DDR3L-1600 (11-11-11)4. DDR3L-1866 (13-13-13)3. Package. 256Mx16. K4B4G1646D-BYH9. K4B4G1646D-BYK0 . K4B4G1646D-BYMA. 96 FBGA. 256Mx16. K4B4G1646D-BYK0 /MA. 96 Ball -FBGA Lead Free & Halogen Free, Flip Chip 1600/1866. 7.5x13.3mm Now. 1G x 4. K4B4G0446E-BY(K0/MA). 78 Ball -FBGA K4B4G1646D-BYK0 /MA. 96 Ball -FBGA. Lead Free & Halogen Free, Flip Chip 1600/1866. 7.5x13.3mm Now. 1G x 4. K4B4G0446E-BYK0/MA. 78 Ball -FBGA. Page 1. - 1 -. Dec. 2012. SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND. SPECIFICATIONS Page 1. Declaration of RoHS Compliance for Samsung Electronics Products. Samsung Electronics Co. Ltd (the Company ) hereby declare that all
1 - 12 of 12 Record(s)
Hot Offer
 Part NumberBrandD/CQtyCompany

K4B4G1646D-BYK0

BGA14+899N&S Electronic Co., Limited    5

K4B4G1646D-BYK0

SAMSUNG13+546TY International components Limited    7

K4B4G1646D-BYK0

SamsungCall5000SSF Group (Asia) Limited    10

K4B4G1646D-BYK0

SAMSUNG16+20000E-NUO LIMITED   1

K4B4G1646D-BYK0

10000Henan Mingyuantong Steels Co.,Ltd.  1

K4B4G1646DBYK0, BR24L32FJWE2, M67191P
 Part NumberBrandD/CQtyCompany

BR24L32FJ-WE2

Rohm Semiconductor15+20000Dedicate Electronics (HK) Limited    7

BR24L32FJ-WE2

ROHM4500CHIPMALL ELECTRONICS LIMITED    3

BR24L32FJ-WE2

ROHM1000ONSTAR ELECTRONICS CO., LIMITED    2

BR24L32FJ-WE2

ROHM07+2009JFJ Electronics Co.,Limited    13

BR24L32FJ-WE2

ROHM07+11357Hong Kong In Fortune Electronics Co., Limited    12

M67191P

MIT99+35Jete (HK) Electronics Limited   3

M67191FP

MIT98+206Jete (HK) Electronics Limited   3

Related Part Number

BR24L32FJWE2 | M67191P | K4B4G1646DBCNB | K4B4G1646DBIK0 | K4B4G1646DBIK000 | K4B4G1646DBIK0000 | K4B4G1646DBMK0000 | K4B4G1646DBYK | K4B4G1646DBYK0 | K4B4G1646DBYK0000 | K4B4G1646DBYKO
K4B4G1646DBYK0 Ref.:
[hkinbatch20171020]
[HGCacheDateZOIBOIZE]
[HGReferer_STC_Overview]
[HKIN20171020GESTYLE]

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