【KA2244 SAMSUNG】【BSF134N10NJ3】【9VRBO】Electronic Components In Stock Suppliers in 2018【Price】【Datasheet PDF】USA

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KA2244 Description

KA2244 . 1 Verteilerfeld. 1V50. 1 SSVerbinder. ZX91. BB2080. 2406,50. Beispiel 109. 7 Z hlerpl tze. 1 Reserveplatz. 1 Verteilerfeld. 3 Z hlerpl tze. 1 Schrank. 1 Komplettfeld. KA2244 . 1 Verteilerfeld. 1V50. 1 SS-Verbinder. ZX91. BB2080. 2645,80. Beispiel 60. 7 Z hlerpl tze. 1 Reserveplatz. 1 Verteilerfeld. 1 Schrank. 8 Z hlerpl tze. 1 Z hlerplatz Allgemein mit Verteiler. 1 Schrank. 5/5A. 1 Komplettfeld. KA2242. 1 Komplettfeld. KA2244 . 1 SS-Verbinder. ZX91. BB2085. 2797,80. 8 Z hlerpl tze. 1 Z hlerplatz Allgemein mit Verteiler. 1 Schrank. 5/5A. 1 Komplettfeld. KA2242. 1 Komplettfeld. KA2244 . 1 SSVerbinder. ZX91. BB2085. 2717,00.
1 - 10 of 10 Record(s)
KA2244, BSF134N10NJ3, 9VRBO
 Part NumberBrandD/CQtyCompany

KA2244

SAMSUNG45SSF Group (Asia) Limited    10

KA2244

SAMSUNG168Bossion International    9

KA22441

KYOCERA690Hongkong Intercell Electronics Co.,Limited    7

KA22441

SAM2016+2000Shenzhen Everbell Technology Co.Ltd   12

BSF134N10NJ3 G

INFINEON65000SUNTOP SEMICONDUCTOR CO., LIMITED    3

BSF134N10NJ3 G

INFINEON12+13000Hong Kong In Fortune Electronics Co., Limited    12

BSF134N10NJ3 G

Infineon Technologies2016+15000MY Group (Asia) Limited    13

BSF134N10NJ3 G

INFINEON17+28000CP MICRO-ELECTRON (HK) INDUSTRIAL CO., LIMITED   1

BSF134N10NJ3G

1000Lungke Electronics Technology Co., Limited    7

9VR-BO

JST1Wintec Mfg. (Japan) Corporation  12

Related Part Number

BSF134N10NJ3 | 9VRBO | KA22428 | KA2242D | KA2243 | KA2246 | KA22461 | KA2247 | KA22471 | KA2247C | KA2248
KA2244 Ref.:
[hkinbatch20171020]
[HGCacheDateZOIBOIZO]
[HGReferer_Escrow]
[HKIN20171020GESTYLE]

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Ceramic components PCB chemicals Clean room clothing Discounted semiconductors EMI shielding Epoxy compounds Ferrite cores/bars/EI Ferrite powder Ferrite plastic Finger cots Dry cells Rechargeable batteries/packs Time switches Lightning and Surge Protection Devices Tachometers DC/DC converters Hinges Heating elements IC packaging materials Insulation materials Iron powder Laminates Lead wire Lenses
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