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EME6300H Sep 17, 2007 Sumitomo has announced discontinuance of the supply of EME 6300H and EME 6300HJ mold compound materials. We are standardizing the Dec 8, 2003 Mold Compound: EME6300H . Wafer Fab Site: TI-Tucson. Die Attach: Ablebond 84-1LMIS. Process: CBC10-A13X. Bond Wire Material: Au. Apr 30, 2009 Conversion of Sumitomo mold compound EME-6300H (being discontinued by manufacturer) to Sumitomo equivalent mold compound 28-lead Small Outline IC package (SOIC). Mold Compound Name/Manufacturer: Sumitomo EME6300H . Mold Compound Flammability Rating: V-O per UL94. Comp. 020308. 28.3-lead (300mils) PDIP package with die size 86.1 x x230.1 using. Sumitomo EME 6300H Molding Compound, OSE Philippines. Mar 02 ...
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