【RA30H3340M101 MITUBISHI】【EP2AGX125DF25I5N】【MDCG4Q18275】Electronic Components In Stock Suppliers in 2017【Price】【Datasheet PDF】USA

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EP2AGX125DF25I5N Description

IC FPGA 260 I/O 572FBGA Number of LABs/CLBs: 4964 Number of Logic Elements/Cells: 118143 Total RAM Bits: 8315904 Number of I/O: 260 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: -40~C ~ 100~C Package / Case: 572-BGA, FCBGA Supplier Device Package: 572-FBGA (25x25)
RA30H3340M101, EP2AGX125DF25I5N, MDCG4Q18275
 Part NumberBrandD/CQtyCompany

RA30H3340M-101

MITUBISHI2015+224Bonase Electronics (HK) Co., Limited    12

RA30H3340M

MIT220OIC Electronics Hong Kong Company Limited    4

RA30H3340M

MITSUBISHI16+820SOUTH MICROELECTRONICS (HK) CO., LIMITED    1

RA30H3340M

MITSUBSHI9WH Technology Company  2

RA30H3340M

MITSUBISHI16+5000ShenZhen HuaXingWei Electronics Co., Ltd.    1

EP2AGX125DF25I5N
 

Altera20131050Digchip Technology Co.,Limited    3

EP2AGX125DF25I5N

ALTERA13+10Top Electronics Co.,    12

EP2AGX125DF25I5N

Altera Corporation16110HongKong Wanghua Technology Limited   3

EP2AGX125DF25I5N
 

ALTERA161E-Core Electronics Co.   8

EP2AGX125DF25I5N

ALTERA2016+10000Yasun Group Electronics Co.,Limited  4

MDCG-4-Q1827-5

Littelfuse14200Longisland Tech Co., Ltd  12

MDCG-4-Q1383-3

Littelfuse7400Longisland Tech Co., Ltd  12

Related Part Number

EP2AGX125DF25I5N | MDCG4Q18275 | RA30H1317M1 | RA30H1317M101 | RA30H1317M1A | RA30H1721M | RA30H1721M101 | RA30H2127 | RA30H2127M | RA30H2127M101 | RA30H3340
RA30H3340M101 Ref.:
[hkinbatch20171020]
[HGCacheDateZOITIZIG]
[HGReferer_Escrow]
[HKIN20171020GESTYLE]

RA30H3340M101 Related Keywords in 2017 USA

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