【RA30H3340M101 MITUBISHI】【EP2AGX125DF25I5N】【MDCG4Q18275】Electronic Components In Stock Suppliers in 2018【Price】【Datasheet PDF】USA

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EP2AGX125DF25I5N Description

IC FPGA 260 I/O 572FBGA Number of LABs/CLBs: 4964 Number of Logic Elements/Cells: 118143 Total RAM Bits: 8315904 Number of I/O: 260 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: -40~C ~ 100~C Package / Case: 572-BGA, FCBGA Supplier Device Package: 572-FBGA (25x25)
1 - 12 of 12 Record(s)
RA30H3340M101, EP2AGX125DF25I5N, MDCG4Q18275
 Part NumberBrandD/CQtyCompany


MITUBISHI2015+224Bonase Electronics (HK) Co., Limited    12


MIT220OIC Electronics Hong Kong Company Limited    4




MITSUBSHI9WH Technology Company  2


MITSUBISHI16+5000ShenZhen HuaXingWei Electronics Co., Ltd.    2


ALTERA1513+39JFJ Electronics Co.,Limited    13


ALTERA161E-Core Electronics Co.   9


ALTERA14+133Hk Guoyuan Electronics Technology Limited    8


ALTERA15+6953Guangzhou Rongken Electronic Technology Co., Ltd   1


ALTERA2012+2Bonase Electronics (HK) Co., Limited    12


Littelfuse10000Longisland Tech Co., Ltd  12


Littelfuse11400Longisland Tech Co., Ltd  12

Related Part Number

EP2AGX125DF25I5N | MDCG4Q18275 | RA30H1317M1 | RA30H1317M101 | RA30H1317M1A | RA30H1721M | RA30H1721M101 | RA30H2127 | RA30H2127M | RA30H2127M101 | RA30H3340
RA30H3340M101 Ref.:

RA30H3340M101 Related Keywords in 2018 USA

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