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【RA60H1317M1A101 MITSUBISHI】【EP2AGX45DF25C5】【B84111FB120】HKinventory - Suppliers in 2017【Price】【Datasheet PDF】USA

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RA60H1317M1A101, EP2AGX45DF25C5, B84111FB120
 Part NumberBrandD/CQtyCompany
RA60H1317M1A-101MITSUBISHI2015+340Bonase Electronics (HK) Co., Limited    11
RA60H1317M1AMITSUBISHI10+295HK Jiaweiyi Technology Limited    11
RA60H1317M
 
MITSUBISHI12+4365E-Core Electronics Co.    7
RA60H1317M1MITSUBISHI05+34Hk Guoyuan Electronics Technology Limited    7
RA60H1317M1MITSUBISHI2015+200Bonase Electronics (HK) Co., Limited    11
EP2AGX45DF25C5
 
ALTERA134E-Core Electronics Co.    7
EP2AGX45DF25C5ALTERA12+2250STJK (HK) Electronics Co.,Limited    2
EP2AGX45DF25C5
 
Altera20131050Digchip Technology Co.,Limited    2
EP2AGX45DF25C5ALTERA14+190Hk Guoyuan Electronics Technology Limited    7
EP2AGX45DF25C5ALTERA14Especnity Electronics (Hongkong) Company Limited    4
B84111FB120500Corich International Ltd.   12
B84111AA20EPCOS14+3Hongkong Rixin International Trading Company    1
B84111FB110500Corich International Ltd.   12
B84111FEpcos15/16+1100Tide Electronic Co.,Limited    7
B84111AA20epcos8Hi-tech (HK) Electronics Co.,Ltd    1

EP2AGX45DF25C5 Description

IC FPGA 252 I/O 572FBGA Number of LABs/CLBs: 1805 Number of Logic Elements/Cells: 42959 Total RAM Bits: 3517440 Number of I/O: 252 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0~C ~ 85~C Package / Case: 572-BGA, FCBGA Supplier Device Package: 572-FBGA (25x25)

Related Part Number

RA60H1317 | RA60H1317M | RA60H1317M1 | RA60H1317M101 | RA60H1317M1A | RA60H3847M1 | RA60H4047M | RA60H4047M1 | RA60H4452M

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RA60H1317M1A101 Ref.: [hkinbatch20161020] [HGCacheDateZOITOIIT] [HGReferer_STC_Overview]
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