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Hong Kong Inventory Limited

【RA60H1317M1A101 MITSUBISHI】【EP2AGX45DF25C5】【B84111FB120】HKinventory - Suppliers in 2017【Price】【Datasheet PDF】USA

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RA60H1317M1A101, EP2AGX45DF25C5, B84111FB120
 Part NumberBrandD/CQtyCompany

RA60H1317M1A-101

MITSUBISHI2015+340Bonase Electronics (HK) Co., Limited    11

RA60H1317M
 

MITSUBISHI12+4365E-Core Electronics Co.    8

RA60H1317M1A

MITSUBISHI10+295HK Jiaweiyi Technology Limited    12

RA60H1317M1

MITSUBISHI2015+200Bonase Electronics (HK) Co., Limited    11

RA60H1317M

MITSUBISHI1000E-Power Market Co.,Ltd   9

EP2AGX45DF25C5
 

ALTERA134E-Core Electronics Co.    8

EP2AGX45DF25C5
 

Altera20131050Digchip Technology Co.,Limited    2

EP2AGX45DF25C5

ALTERA12+2250STJK (HK) Electronics Co.,Limited    2

EP2AGX45DF25C5

ALTERA14+190Hk Guoyuan Electronics Technology Limited    8

EP2AGX45DF25C5

ALTERA2016+10000Yasun Group Electronics Co.,Limited  4

B84111FB120

100Corich International Ltd.   13

B84111AB120

EPCOS1052Top Electronics Co.,    12

B84111FB110

100Corich International Ltd.   13

B84111AB110

epcos16+62000APEX ELECTRONICS CO., LIMITED   3

B84111AA20

epcos26320Hi-tech (HK) Electronics Co.,Ltd    2

EP2AGX45DF25C5 Description

IC FPGA 252 I/O 572FBGA Number of LABs/CLBs: 1805 Number of Logic Elements/Cells: 42959 Total RAM Bits: 3517440 Number of I/O: 252 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0~C ~ 85~C Package / Case: 572-BGA, FCBGA Supplier Device Package: 572-FBGA (25x25)

Related Part Number

EP2AGX45DF25C5 | B84111FB120 | RA60H1317 | RA60H1317M | RA60H1317M1 | RA60H1317M101 | RA60H1317M1A | RA60H3847M1 | RA60H4047M | RA60H4047M1 | RA60H4452M
RA60H1317M1A101 Ref.: [hkinbatch20170420] [HGCacheDateZOITOTZS] [HGReferer_STC_Overview] [HKINGESTYLE]

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