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【RD38F4055L0YBQ0 INTEL】【EP3SE260F1517I4L】【HI6451GBCV110】Electronic Components In Stock Suppliers in 2017【Price】【Datasheet PDF】USA

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Search For RD38F4055L0YBQ0 - RD38F4055L0YBQ0 Suppliers : 

Bossion International Pte. Ltd, Shenzhen Chuangxinda Electronic-Tech Co.,Ltd ...
Product Information1 - 15 of 15 Record(s) PREV Page NEXT
Part NumberPart Number BrandD/CQtyCountry /
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RD38F4055L0YBQ0

RD38F4055L0YBQ0 INTEL16485Singapore
Bossion International Pte. Ltd  6

RD38F4050L0YBQ1

RD38F4050L0YBQ1 INTEL0544+6000China
Shenzhen Chuangxinda Electronic-Tech Co.,Ltd  14

RD38F4455LLYBQ1

RD38F4455LLYBQ1 INTEL05+148Hong Kong
Hongkong Rixin International Trading Company  1

RD38F4470LLYFH0

RD38F4470LLYFH0 INTELSIL0608+168China
Kunlida Electronics (HK) Limited  5

RD38F4050L0YTQ1

RD38F4050L0YTQ1 ITL201620000China
Shenzhen KHS Electronics Company 13

EP3SE260F1517I4L

EP3SE260F1517I4L ALTERA186Hong Kong
E-Core Electronics Co.  8

EP3SE260F1517I4L

EP3SE260F1517I4L Altera20131050Hong Kong
Digchip Technology Co.,Limited  2

EP3SE260F1517I4L

EP3SE260F1517I4L ALTERA14+177China
VLO International Co. Ltd.  11

EP3SE260F1517I4L

EP3SE260F1517I4L 600China
ICMALL LIMITED 3

EP3SE260F1517I4L

EP3SE260F1517I4L ALTERA1000China
Kang Da Electronics Co.  12

HI6451GBCV110

HI6451GBCV110 HiSilic1411+145China
SOUTH MICROELECTRONICS (HK) CO., LIMITED  1

Hi6451GBC

Hi6451GBC HiSi1221+4632Hong Kong
Hongkong Rixin International Trading Company  1

Hi6451GBC

Hi6451GBC HiSi1221+5532China
Hong Kong In Fortune Electronics Co., Limited  12

Hi6451GBC

Hi6451GBC HiSi20China
CHIPMALL ELECTRONICS LIMITED  2

HI6451QBC

HI6451QBC HI1241+54China
Briew Technology (HK) Limited  3

Buy: RD38F4055L0YBQ0, EP3SE260F1517I4L, HI6451GBCV110
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EP3SE260F1517I4L | HI6451GBCV110 | RD33F/JM | RD33FB2 | RD33FM | RD35HUF2 | RD36M | RD38F3050L0YTQ1 | RD38F4050L0YTQ1 | RD38F4350LLYTQ1 | RD39EB2AZ
 [hkinbatch20170420] [HGCacheDateZOITOTZT] [HGReferer_SD_Overview] [HKIN20170720PDSTYLE]
EP3SE260F1517I4L IC FPGA 976 I/O 1517FBGA Number of LABs/CLBs: 10200 Number of Logic Elements/Cells: 255000 Total RAM Bits: 16672768 Number of I/O: 976 Number of Gates: - Voltage - Supply: 0.86 V ~ 1.15 V Mounting Type: Surface Mount Operating Temperature: -40~C ~ 100~C Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40), HI6451GBCV110 HI6451GBCV110, HiSilic, BGA, Semiconductors, Integrated Circuits (ICs)

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