【RD38F4055L0YBQ0 INTEL】【EP3SE260F1517I4L】【HI6451GBCV110】Electronic Components In Stock Suppliers in 2018【Price】【Datasheet PDF】USA

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EP3SE260F1517I4L Description

IC FPGA 976 I/O 1517FBGA Number of LABs/CLBs: 10200 Number of Logic Elements/Cells: 255000 Total RAM Bits: 16672768 Number of I/O: 976 Number of Gates: - Voltage - Supply: 0.86 V ~ 1.15 V Mounting Type: Surface Mount Operating Temperature: -40~C ~ 100~C Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)

HI6451GBCV110 Description

HI6451GBCV110, HiSilic, BGA, Semiconductors, Integrated Circuits (ICs)
1 - 15 of 15 Record(s)
RD38F4055L0YBQ0, EP3SE260F1517I4L, HI6451GBCV110
 Part NumberBrandD/CQtyCompany

RD38F4055L0YBQ0

INTEL16485Bossion International Pte. Ltd    6

RD38F4050L0YBQ1

INTEL0544+6000JFJ Electronics Co.,Limited    13

RD38F4470LLYFH0
 

INTELSIL0608+168Kunlida Electronics (HK) Limited    5

RD38F4050M0Y0C0

INTEL104Sinno Electronics Co., Limited    8

RD38F4050L0YTQ1

ITL201620000Shenzhen KHS Electronics Company   14

EP3SE260F1517I4L
 

ALTERA2015+1000Hong Kong Red Top Boat Development Co., Limited    1

EP3SE260F1517I4L

Altera15+1120Splendent Technologies Pte Ltd    4

EP3SE260F1517I4L
 

ALTERA2008500Kang Da Electronics Co.    13

EP3SE260F1517I4L
 

ALTERA186E-Core Electronics Co.   8

EP3SE260F1517I4L
 

600ICMALL LIMITED   4

HI6451GBCV110

HiSilic1411+145SOUTH MICROELECTRONICS (HK) CO., LIMITED    1

Hi6451GBC

HiSi1221+4632Hongkong Rixin International Trading Company    2

Hi6451GBC

HiSi1221+5532Hong Kong In Fortune Electronics Co., Limited    12

Hi6451GBC

HiSi20CHIPMALL ELECTRONICS LIMITED    3

HI6451QBC

HI1241+54Briew Technology (HK) Limited    4

Related Part Number

EP3SE260F1517I4L | HI6451GBCV110 | RD38F4050L0YTQ1 | RD38F4350LLYTQ1 | RD39320 | RD39EB2AZ | RD39ES | RD39EST1 | RD39ST2A | RD3A2BY912JT2 | RD3CYD08CME
RD38F4055L0YBQ0 Ref.:
[hkinbatch20171020]
[HGCacheDateZOIBOIZO]
[HGReferer_SD_Overview]
[HKIN20171020GESTYLE]

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