【RO3210 ROGERS】【EPF10K50EFC2562】【BCM4321SA04】Electronic Components In Stock Suppliers in 2017【Price】【Datasheet PDF】USA

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RO3210 Description

DATASHEET C08BL242X-5UN-X0B. PCB. RO3210 . Rogers r = 10.2; h = 25 mil. IMN. Distributed transmission line input network. OMN. Distributed transmission line output www.triquint.com. Evaluation Board Layout. Top RF layer is 0.025 thick Rogers RO3210 , r = 10.2. The pad pattern shown has been developed and tested for
RO3210, EPF10K50EFC2562, BCM4321SA04
 Part NumberBrandD/CQtyCompany

RO3210

ROGERS15/16+1200Tide Electronic Co.,Limited    8

EPF10K50EFC256-2
 

ALTERA3942Riking Technology (HK) Co., Limited    8

EPF10K50EFC256-2

ALTERA15+654Texas Company    12

EPF10K50EFC256-2
 

Altera20131050Digchip Technology Co.,Limited    3

EPF10K50EFC256-2

ALTERA27TY International components Limited    7

EPF10K50EFC256-2

ALTERA03+279Icwindows Electronics HK Co.,Limited   11

BCM4321SA04

Broadcom946SSF Group (Asia) Limited    10

BCM43217TKMLG

30000Daejon Electronics  6

BCM4322KFBGH

BROADCOM09+560Huahui (Hongkong) Electron Limited    3

BCM4321LKFBG

BROADCOM633Sunrich-Tech Corporation   6

BCM4321KFBG

BROADCOM09+1738Gaokeda Technology (HK) Limited    10

Related Part Number

EPF10K50EFC2562 | BCM4321SA04 | RO3203 | RO32513 | RO3305S | RO3333S | RO3333S/P | RO3566067 | RO4003 | RO4003C | RO4233
RO3210 Ref.:
[hkinbatch20171020]
[HGCacheDateZOITIZIT]
[HGReferer_SD_Overview]
[HKIN20171020GESTYLE]

RO3210 Related Keywords in 2017 USA

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