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【SAC105】【EUA2123XIR1】【KIA4401S/P】Electronic Components In Stock Suppliers in 2018【Price】【Datasheet PDF】USA

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SAC105 SAC 105 , CuPd Wire. MSL3, 260 C Reflow. ASE-Taiwan (G). FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT reliability@cypress.com or via a Package Qualification Report. QTP# 123401 VERSION*D. October 2014. 60 & 70 UFBGA (5.5x5.5x0.6mm). 84 UFBGA (6x6x0.6mm). SAC105 , MSL3, 260 C using 0.8mil CuPd wire with GR9810 mold compound, QMI-506 die attach material and SAC-105 ball finish at MSL3, 260C Reflow. Temperature. July. 2015 Aug 26, 2016 84 TFBGA 6x6x1.0 SAC105 . Basic Substance. CAS Number. Contained In. Sub -Component. % Total. Weight mg/part ppm. 64.60. (mg) Total. Aug 26, 2016 Compliant with IEC 62474/ D9.00. Compliant to IEC 61249-2-21:2003. Semiconductor Device Type: 7GX. 169 TFBGA 10x10x1.1mm SAC105 . ...
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Part NumberPart Number BrandD/CQtyCountry /


SAC105 21243USA
Chip 1 Exchange USA, Inc.  1


EUA2123XIR1 EUTECH10000China
HK Niuhuasi Technology Limited  8


EUA2123XIR1 EUTECH16+10000China
Riking Technology (HK) Co., Limited  9


EUA2123XIR1 EUTECH14+12886China


EUA2123XIR1 EUTECH14+10900China
Hong Kong In Fortune Electronics Co., Limited  13


EUA2123 EUTECH15/16+30000China
Tide Electronic Co.,Limited  9


KIA4401-S/P Kec4464Taiwan
Longisland Tech Co., Ltd13

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