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【W25Q32FVSIG Winbond】【HY5116160CT50】【2N487A】HKinventory - Suppliers in 2016【Price】【Datasheet PDF】USA

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W25Q32FVSIG, HY5116160CT50, 2N487A
 Part NumberBrandD/CQtyCompany
Winbond12+947Hongkong Intercell Electronics Co.,Limited    6
Winbond1516+11000Shenzhen Chuangxinda Electronic-Tech Co.,Ltd    13
Winbond1516+11000Min Xin Technology (H.K.) Electronics Co.    12
W25Q32FVSIGWINBOND15+1150000Hong Kong In Fortune Electronics Co., Limited    11
HYNIX14+4500Hk Guoyuan Electronics Technology Limited   7
HYUNDAI05+11589Kehai Weiye International Electronics Limited    10
HY5116160CT-50HYUNDAI03+8336Ocean International Electronics Limited    9
HY5116160CT-50HYNIX04+9865Sunton Electronics Co., Limited    11
HY5116160CT-50HYNIX05+34624HK Jiaweiyi Technology Limited    11
2N487A2000Novelty Electronics Limited   7

W25Q32FVSIG Description

W25Q32BVSSIG because the original source Atmel* AT26DF321-SU has been discontinued. The source part for the BMC firmware flash chip is changing to Jan 13, 2011 1.27mm pitch. 12 SPI-FLASH (Quad). S25FL064P0XMFI001 (Spansion). 64Mbit. 13 SPI-FLASH (Single). W25Q32BVSSIG (Winbond). 32Mbit. Oct 13, 2010 W25Q32BVSSIG because the original source Atmel* AT26DF321-SU has been discontinued. The source part for the BMC firmware flash chip Mar 16, 2010 device ( W25Q32BVSSIG ) at location U23 for DG45ID and U35 for DG45FC. 2. BIOS update from IDG4510H.86A.0097 to IDG4510H.86A.0127 Jul 15, 2010 The source part of BIOS flash chip is changing to Winbond* W25Q32BVSSIG because the original source Atmel* AT26DF321-SU has been

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W25Q32FVSIG Ref.: [hkinbatch20160715] [HGReferer_SD_Overview]
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