【XC1701LPD8C Memory - Configuration Proms for FPGAs XILINX】Electronic Components In Stock Suppliers in 2019【Price】【Datasheet PDF】USA

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Part Number:

XC1701LPD8C

Catagory:

Integrated Circuits (ICs) > Memory - Configuration Proms for FPGAs

Brand:

Xilinx Inc.

Description:

IC 1 MB 3.3V SER CONF PROM 8-DIP

Series:

-

Packaging:

Tube

Programmable Type:

OTP

Memory Size:

1Mb

Voltage - Supply:

3 V ~ 3.6 V

Operating Temperature:

0°C ~ 70°C

Package / Case:

8-DIP (0.300", 7.62mm)

Supplier Device Package:

8-PDIP

XC1701LPD8C Description

IC 1 MB 3.3V SER CONF PROM 8-DIP Series: - Programmable Type: OTP Memory Size: 1Mb Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: 0~C ~ 70~C Package / Case: 8-DIP (0.300, 7.62mm) Supplier Device Package: 8-PDIP
1 - 5 of 5 Record(s)
Hot Offer
 Part NumberBrandD/CQtyCompany

XC1701LPD8C

XILINX11+36Yat Nang Technology   13

XC1701LPD8C
 Part NumberBrandD/CQtyCompany

XC1701LPD8C

XILINX3952Ande Electronics Co., Limited    13

XC1701LPD8C

XILINX2015+1400Bonase Electronics (HK) Co., Limited    13

XC1701LPD8C

XIL2018+10000Yasun Group Electronics Co.,Limited  6
STRC

XC1701LPD8C
 

XILINX0125+826TY International Trade Limited    8

Related Part Number

EPCQL256F24IN | EPCQL512F24IN | EPCQL256F24IN | EPCQL512F24IN | EPCS128SI16N | EPCS16SI16N | EPCS16SI8N | EPCS1SI8 | EPCS1 SI8N | EPCS4SI8N | EPCS64SI16N
XC1701LPD8C Ref.:
[hkinbatch20181020]
[HGCacheDateZOIPOZZA]
[HGReferer_Escrow]
[HKIN20180420GESTYLE]
[HKIN20171020MDPartDetails]

XC1701LPD8C Related Keywords in 2019 USA

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