【XC3S1000FG320 XILINX】【MAX9789AETJT】【AGC31/2R】Electronic Components In Stock Suppliers in 2018【Price】【Datasheet PDF】USA

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XC3S1000FG320 Description

Sep 25, 2006 The purpose of this notice is to announce the addition of STATS ChipPAC in Singapore (SCS) as a qualified assembly partner for Plastic Quad 2006 12 25 Thin Quad Flat Pack (TQFP/VQFP) Ball Grid Array (BGA) .
1 - 11 of 11 Record(s)
XC3S1000FG320, MAX9789AETJT, AGC31/2R
 Part NumberBrandD/CQtyCompany


XILINX09+2500Gaokeda Technology (HK) Limited    10


1Digchip Technology Co.,Limited    3




5Q2 Communication Technology,Ltd  2


XILINX450United Sources Industrial Enterprises Limited    17


MAX6500C & I Semiconductors Co., Limited    8


MAXIM0943+8525Sinno Electronics Co., Limited    8


MAXIM0948+309Splendent Technologies Pte Ltd    4


MAXIM950Top Electronics Co.,    12


MAXIM1656Nantian Electronics Co., Limited   9


Cooper Bussmann35100HongKong Wanghua Technology Limited   4

Related Part Number

MAX9789AETJT | AGC31/2R | XC3S1000BG456 | XC3S1000E | XC3S1000E6FG320C | XC3S1000FG320 | XC3S1000FG456C | XC3S1000FG456EGQ | XC3S1000FGG320 | XC3S1000FGG456EGQ | XC3S1000FT256
XC3S1000FG320 Ref.:

XC3S1000FG320 Related Keywords in 2018 USA

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