【XC3S250EVQG100 XILINX】Electronic Components In Stock Suppliers in 2018【Price】【Datasheet PDF】USA

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XC3S250EVQG100 Description

Sep 25, 2006 The purpose of this notice is to announce the addition of STATS ChipPAC in Singapore (SCS) as a qualified assembly partner for Plastic Quad Flat Pack ( PQFP), Thin Quad Flat Pack (TQFP/VQFP), and Ball Grid Array in wire 2006 12 25 Thin Quad Flat Pack (TQFP/VQFP) Ball Grid Array (BGA) . ( .
1 - 5 of 5 Record(s)
 Part NumberBrandD/CQtyCompany


XILINX06+45SSF Group (Asia) Limited    11


XILINX09+5000Gaokeda Technology (HK) Limited    11


XILINX06+77HK Jiaweiyi Technology Limited    13


XILINX06+118Bossion International    10


XILINX16+2000Yingxinyuan INT'L (Group) Limited    15

Related Part Number

XC3S250EVQG100DGQ | XC3S250VQ100 | XC3S250ETQ144 | XC3S250ETQG144 | XC3S250EVG100 | XC3S250EVQ100 | XC3S250EVQG100DGQ | XC3S250VQ100 | XC3S25EQG100C | XC3S300-4TQ144C | XC3S300-4TQ144I
XC3S250EVQG100 Ref.:

XC3S250EVQG100 Related Keywords in 2018 USA

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Calibrators OEM/ODM, production/services Pad printing Screen printing Servo heads Soft ferrite magnets Special magnets Special purpose core Magnets heads Antenna parts RF antennas Satellite antennas Telephone antennas CATV/MATV components Satellite TV components Antennas CATV/MATV parts CAD IC design PBC design Product design Modeling Design services Adhesives for electronics production Carrier tapes
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