【XC3S250EVQG100 XILINX】Electronic Components In Stock Suppliers in 2018【Price】【Datasheet PDF】USA

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XC3S250EVQG100 Description

Sep 25, 2006 The purpose of this notice is to announce the addition of STATS ChipPAC in Singapore (SCS) as a qualified assembly partner for Plastic Quad Flat Pack ( PQFP), Thin Quad Flat Pack (TQFP/VQFP), and Ball Grid Array in wire 2006 12 25 Thin Quad Flat Pack (TQFP/VQFP) Ball Grid Array (BGA) . ( .
1 - 5 of 5 Record(s)
XC3S250EVQG100
 Part NumberBrandD/CQtyCompany

XC3S250EVQG100

XILINX06+45SSF Group (Asia) Limited    11

XC3S250EVQG100

XILINX09+5000Gaokeda Technology (HK) Limited    11

XC3S250EVQG100

XILINX06+77HK Jiaweiyi Technology Limited    13

XC3S250EVQG100

XILINX06+118Bossion International    10
STRCWarranty

XC3S250E-4VQ100C
 

XILINX16+2000Yingxinyuan INT'L (Group) Limited    15

Related Part Number

XC3S250EVQG100DGQ | XC3S250VQ100 | XC3S250ETQ144 | XC3S250ETQG144 | XC3S250EVG100 | XC3S250EVQ100 | XC3S250EVQG100DGQ | XC3S250VQ100 | XC3S25EQG100C | XC3S300-4TQ144C | XC3S300-4TQ144I
XC3S250EVQG100 Ref.:
[hkinbatch20180420]
[HGCacheDateZOIBIZIB]
[HGReferer_TRC]
[HKIN20180420GESTYLE]

XC3S250EVQG100 Related Keywords in 2018 USA

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