【XC3S250EVQG100 XILINX】Electronic Components In Stock Suppliers in 2018【Price】【Datasheet PDF】USA
XC3S250EVQG100 DescriptionSep 25, 2006 The purpose of this notice is to announce the addition of STATS ChipPAC in Singapore (SCS) as a qualified assembly partner for Plastic Quad Flat Pack ( PQFP), Thin Quad Flat Pack (TQFP/VQFP), and Ball Grid Array in wire 2006 12 25 Thin Quad Flat Pack (TQFP/VQFP) Ball Grid Array (BGA) . ( .
| ||Part Number||Brand||D/C||Qty||Company|
|XILINX||06+||45||SSF Group (Asia) Limited || || ||11|
|XILINX||09+||5000||Gaokeda Technology (HK) Limited || || ||11|
|XILINX||06+||77||HK Jiaweiyi Technology Limited || || ||13|
|XILINX||06+||118||Bossion International || || ||10|
|XILINX||16+||2000||Yingxinyuan INT'L (Group) Limited || || ||15|
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