【XC6SLX75T-3FGG676I XILINX】Electronic Components In Stock Suppliers in 2018【Price】【Datasheet PDF】USA
XC6SLX75T-3FGG676I DescriptionIC FPGA 348 I/O 676FBGA Number of LABs/CLBs: 5831 Number of Logic Elements/Cells: 74637 Total RAM Bits: 3170304 Number of I/O: 348 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40～C ~ 100～C Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27)
XC6SLX75T-3FGG676I Related Keywords in 2018 USA
- XC6SLX75T-3FGG676I Price
- XC6SLX75T-3FGG676I Distributor
- XC6SLX75T-3FGG676I Manufacturer
- XC6SLX75T-3FGG676I Technical Data
- XC6SLX75T-3FGG676I PDF
- XC6SLX75T-3FGG676I Datasheet
- XC6SLX75T-3FGG676I Picture
- XC6SLX75T-3FGG676I Image
- XC6SLX75T-3FGG676I Part
- XC6SLX75T-3FGG676I Stock
- XC6SLX75T-3FGG676I Inventory
- XC6SLX75T-3FGG676I Rfq
- Buy XC6SLX75T-3FGG676I
- XC6SLX75T-3FGG676I Inquiry
- XC6SLX75T-3FGG676I Online Order
For all Home Side Position, a text banner ad will also appear in our "Part Number Seach Result" page and "Part Details" page.
HKin.com advertises product requirements from buyers around the world. The number of inquiries exchanged is over 350,000 cases per month, and lots of trade deals concluding everyday.
Reproduction in whole or in part in any form without the written permission of Hong Kong Inventory Limited is prohibited. All rights reserved.
Our new customer services center at Shenzhen SEG Electronics Market becomes the first focal tactic after the 6th anniversary. HKI is the initial electronics components trading online platform to have customer services center.
A trading hub for brokers, merchandisers and distributors to trade all kinds of electronic components, including semiconductors, passive components, obsolete and hard-to-find parts.
Ceramic components PCB chemicals Clean room clothing Discounted semiconductors EMI shielding Epoxy compounds Ferrite cores/bars/EI Ferrite powder Ferrite plastic Finger cots Dry cells Rechargeable batteries/packs Time switches Lightning and Surge Protection Devices Tachometers DC/DC converters Hinges Heating elements IC packaging materials Insulation materials Iron powder Laminates Lead wire Lenses